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PCF8591TD
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberPCF8591TD
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DescriptionANALOG CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
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Datasheet
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DetailsPCF8591TD Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Width (mm): | 7.5 mm |
Maximum Seated Height: | 2.65 mm |
Minimum Supply Voltage (Vsup): | 2.5 V |
Surface Mount: | YES |
Terminal Finish: | NICKEL PALLADIUM GOLD |
No. of Terminals: | 16 |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE |
Technology: | CMOS |
JESD-30 Code: | R-PDSO-G16 |
Package Shape: | RECTANGULAR |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 85 Cel |
Package Code: | SOP |
Nominal Supply Voltage (Vsup): | 5 V |
JESD-609 Code: | e4 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Other IC type: | ANALOG CIRCUIT |
Length: | 10.3 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 6 V |