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P82B96DP,118

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

P82B96DP,118
Description

BUS BUFFERS; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
Datasheet

Datasheet

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P82B96DP,118 Technical Details

TYPE	DESCRIPTION
Minimum Supply Voltage:	2 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	5 V
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.1 mm
Sub-Category:	Other Interface ICs
Surface Mount:	YES
Terminal Finish:	NICKEL PALLADIUM GOLD
No. of Terminals:	8
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology:	BIPOLAR
JESD-30 Code:	S-PDSO-G8
Package Shape:	SQUARE
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Package Code:	TSSOP
Interface IC Type:	BUS BUFFERS
Width:	3 mm
Moisture Sensitivity Level (MSL):	1
Other Names:	568-3197-1 568-3197-2 935276269431 P82B96DP-T P82B96DP118 568-3197-5 568-3197-6 NXPNXPP82B96DP,118 568-3197-5-ND 2156-P82B96DP,118 935276269118
Maximum Supply Voltage:	15 V
JESD-609 Code:	e4
Minimum Operating Temperature:	-40 Cel
No. of Functions:	2
Qualification:	Not Qualified
Package Equivalence Code:	TSSOP8,.19
Length:	3 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	.65 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	2/15

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