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MVF61NN151CMK50
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberMVF61NN151CMK50
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DescriptionMICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 364; Package Code: BGA; Package Shape: SQUARE;
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Datasheet
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DetailsMVF61NN151CMK50 Technical Details
TYPE | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.16 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.23 V |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
Maximum Supply Current: | 850 mA |
Terminal Finish: | TIN SILVER COPPER |
ADC Channels: | YES |
No. of Terminals: | 364 |
DMA Channels: | YES |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
No. of I/O Lines: | 131 |
Address Bus Width: | 16 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B364 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | BGA |
Width: | 17 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 500 rpm |
Peripheral IC Type: | MICROCONTROLLER, RISC |
Maximum Supply Voltage: | 1.26 V |
RAM Bytes: | 1572864 |
External Data Bus Width: | 16 |
Bit Size: | 16 |
DAC Channels: | YES |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA364,20X20,32 |
Length: | 17 mm |
PWM Channels: | NO |
Peak Reflow Temperature (C): | 260 |
ROM Programmability: | FLASH |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 3.3 |