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MVF61NN151CMK50

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

MVF61NN151CMK50
Description

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 364; Package Code: BGA; Package Shape: SQUARE;
Datasheet

716 In Stock

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MVF61NN151CMK50 Technical Details

TYPE	DESCRIPTION
Minimum Supply Voltage:	1.16 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	1.23 V
Maximum Time At Peak Reflow Temperature (s):	40
Sub-Category:	Microcontrollers
Surface Mount:	YES
Maximum Supply Current:	850 mA
Terminal Finish:	TIN SILVER COPPER
ADC Channels:	YES
No. of Terminals:	364
DMA Channels:	YES
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
No. of I/O Lines:	131
Address Bus Width:	16
Technology:	CMOS
JESD-30 Code:	S-PBGA-B364
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	BGA
Width:	17 mm
Moisture Sensitivity Level (MSL):	3
Speed:	500 rpm
Peripheral IC Type:	MICROCONTROLLER, RISC
Maximum Supply Voltage:	1.26 V
RAM Bytes:	1572864
External Data Bus Width:	16
Bit Size:	16
DAC Channels:	YES
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
Qualification:	Not Qualified
Package Equivalence Code:	BGA364,20X20,32
Length:	17 mm
PWM Channels:	NO
Peak Reflow Temperature (C):	260
ROM Programmability:	FLASH
Terminal Pitch:	.8 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	3.3

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