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MK64FN1M0VMD12

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

MK64FN1M0VMD12
Description

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: BGA; Package Shape: SQUARE;
Datasheet

Datasheet

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MK64FN1M0VMD12 Technical Details

TYPE	DESCRIPTION
Minimum Supply Voltage:	1.71 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.3 V
Maximum Time At Peak Reflow Temperature (s):	40
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
ADC Channels:	YES
No. of Terminals:	144
DMA Channels:	YES
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
No. of I/O Lines:	100
Address Bus Width:	0
Technology:	CMOS
JESD-30 Code:	S-PBGA-B144
Maximum Clock Frequency:	50 MHz
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	105 Cel
Package Code:	BGA
Width:	13 mm
Moisture Sensitivity Level (MSL):	3
Speed:	120 rpm
Peripheral IC Type:	MICROCONTROLLER, RISC
Maximum Supply Voltage:	3.6 V
External Data Bus Width:	0
DAC Channels:	YES
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
Length:	13 mm
PWM Channels:	YES
Peak Reflow Temperature (C):	260
ROM Programmability:	FLASH
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL

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