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HEF4093BTD

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

HEF4093BTD
Description

NAND GATE; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
Datasheet

Datasheet

4844 In Stock

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HEF4093BTD Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Schmitt Trigger:	YES
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.75 mm
No. of Inputs:	2
Minimum Supply Voltage (Vsup):	3 V
Sub-Category:	Gates
Surface Mount:	YES
Terminal Finish:	Nickel/Palladium/Gold (Ni/Pd/Au)
No. of Terminals:	14
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE
Technology:	CMOS
JESD-30 Code:	R-PDSO-G14
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Package Code:	SOP
Propagation Delay At Nominal Supply:	185 ns
Width:	3.9 mm
Moisture Sensitivity Level (MSL):	1
Packing Method:	BULK
Load Capacitance (CL):	50 pF
Logic IC Type:	NAND GATE
JESD-609 Code:	e4
Minimum Operating Temperature:	-40 Cel
No. of Functions:	4
Qualification:	Not Qualified
Package Equivalence Code:	SOP14,.25
Length:	8.65 mm
Propagation Delay (tpd):	185 ns
Nominal Supply Voltage / Vsup (V):	5
Family:	4000/14000/40000
Peak Reflow Temperature (C):	260
Terminal Pitch:	1.27 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	15 V
Power Supplies (V):	5/15

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