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BZV55-C12
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberBZV55-C12
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DescriptionZENER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
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Datasheet
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DetailsBZV55-C12 Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | GLASS |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Working Test Current: | 5 mA |
Config: | SINGLE |
Diode Type: | ZENER DIODE |
Maximum Voltage Temperature Coefficient: | 10 mV/Cel |
Sub-Category: | Voltage Reference Diodes |
Surface Mount: | YES |
Terminal Finish: | Tin (Sn) |
Maximum Reverse Current: | .1 uA |
No. of Terminals: | 2 |
Terminal Position: | END |
Package Style (Meter): | LONG FORM |
Technology: | ZENER |
JESD-30 Code: | O-LELF-R2 |
No. of Elements: | 1 |
Package Shape: | ROUND |
Terminal Form: | WRAP AROUND |
Polarity: | UNIDIRECTIONAL |
Maximum Operating Temperature: | 200 Cel |
Case Connection: | ISOLATED |
Maximum Dynamic Impedance: | 25 ohm |
Moisture Sensitivity Level (MSL): | 1 |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -65 Cel |
Maximum Voltage Tolerance: | 5 % |
Diode Element Material: | SILICON |
Qualification: | Not Qualified |
Nominal Reference Voltage: | 12.05 V |
Maximum Power Dissipation: | .4 W |
Peak Reflow Temperature (C): | 260 |