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BZV55-C12

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

BZV55-C12
Description

ZENER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Datasheet

Datasheet

5153 In Stock

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BZV55-C12 Technical Details

TYPE	DESCRIPTION
Package Body Material:	GLASS
Maximum Time At Peak Reflow Temperature (s):	30
Working Test Current:	5 mA
Config:	SINGLE
Diode Type:	ZENER DIODE
Maximum Voltage Temperature Coefficient:	10 mV/Cel
Sub-Category:	Voltage Reference Diodes
Surface Mount:	YES
Terminal Finish:	Tin (Sn)
Maximum Reverse Current:	.1 uA
No. of Terminals:	2
Terminal Position:	END
Package Style (Meter):	LONG FORM
Technology:	ZENER
JESD-30 Code:	O-LELF-R2
No. of Elements:	1
Package Shape:	ROUND
Terminal Form:	WRAP AROUND
Polarity:	UNIDIRECTIONAL
Maximum Operating Temperature:	200 Cel
Case Connection:	ISOLATED
Maximum Dynamic Impedance:	25 ohm
Moisture Sensitivity Level (MSL):	1
JESD-609 Code:	e3
Minimum Operating Temperature:	-65 Cel
Maximum Voltage Tolerance:	5 %
Diode Element Material:	SILICON
Qualification:	Not Qualified
Nominal Reference Voltage:	12.05 V
Maximum Power Dissipation:	.4 W
Peak Reflow Temperature (C):	260

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