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74LVC2G17GV,125
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ManufacturerNXP Semiconductors
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Manufacturer's Part Number74LVC2G17GV,125
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DescriptionBUFFER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
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Datasheet
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Details74LVC2G17GV,125 Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Schmitt Trigger: | YES |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1.1 mm |
No. of Inputs: | 1 |
Minimum Supply Voltage (Vsup): | 1.65 V |
Sub-Category: | Gates |
Surface Mount: | YES |
Terminal Finish: | Tin (Sn) |
No. of Terminals: | 6 |
Maximum I (ol): | 24 Amp |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PDSO-G6 |
Package Shape: | RECTANGULAR |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 125 Cel |
Package Code: | TSSOP |
Propagation Delay At Nominal Supply: | 7.1 ns |
Width: | 1.5 mm |
Moisture Sensitivity Level (MSL): | 1 |
Packing Method: | TR |
Load Capacitance (CL): | 50 pF |
Logic IC Type: | BUFFER |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 2 |
Qualification: | Not Qualified |
Package Equivalence Code: | TSOP6,.11,37 |
Length: | 2.9 mm |
Propagation Delay (tpd): | 13.1 ns |
Nominal Supply Voltage / Vsup (V): | 1.8 |
Family: | LVC/LCX/Z |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .95 mm |
Temperature Grade: | AUTOMOTIVE |
Maximum Supply Voltage (Vsup): | 5.5 V |
Power Supplies (V): | 3.3 |