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74LVC1G17GW,125
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ManufacturerNXP Semiconductors
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Manufacturer's Part Number74LVC1G17GW,125
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DescriptionBUFFER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: TSSOP; Package Shape: RECTANGULAR;
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Datasheet
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Details74LVC1G17GW,125 Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Schmitt Trigger: | YES |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.1 mm |
| No. of Inputs: | 1 |
| Minimum Supply Voltage (Vsup): | 1.65 V |
| Sub-Category: | Gates |
| Surface Mount: | YES |
| Terminal Finish: | TIN |
| No. of Terminals: | 5 |
| Maximum I (ol): | 24 Amp |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G5 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | TSSOP |
| Propagation Delay At Nominal Supply: | 7 ns |
| Width: | 1.25 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Packing Method: | TR |
| Load Capacitance (CL): | 50 pF |
| Logic IC Type: | BUFFER |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TSSOP5/6,.08 |
| Length: | 2.05 mm |
| Propagation Delay (tpd): | 14 ns |
| Nominal Supply Voltage / Vsup (V): | 3 |
| Family: | LVC/LCX/Z |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | AUTOMOTIVE |
| Maximum Supply Voltage (Vsup): | 5.5 V |
| Power Supplies (V): | 3.3 |