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74HC4050D,653

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

74HC4050D,653
Description

BUFFER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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74HC4050D,653 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s):	30
No. of Inputs:	1
Minimum Supply Voltage (Vsup):	2 V
Surface Mount:	YES
Terminal Finish:	Nickel/Palladium/Gold (Ni/Pd/Au)
No. of Terminals:	16
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE
Technology:	CMOS
JESD-30 Code:	R-PDSO-G16
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	125 Cel
Package Code:	SOP
Moisture Sensitivity Level (MSL):	1
Load Capacitance (CL):	50 pF
Logic IC Type:	BUFFER
JESD-609 Code:	e4
Minimum Operating Temperature:	-40 Cel
No. of Functions:	6
Qualification:	Not Qualified
Propagation Delay (tpd):	26 ns
Nominal Supply Voltage / Vsup (V):	5
Additional Features:	CMOS-TTL LEVEL TRANSLATOR
Family:	HC/UH
Peak Reflow Temperature (C):	260
Temperature Grade:	AUTOMOTIVE
Maximum Supply Voltage (Vsup):	6 V

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