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LMP8601MAX/NOPB
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ManufacturerNational Semiconductor
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Manufacturer's Part NumberLMP8601MAX/NOPB
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DescriptionANALOG CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
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Datasheet
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DetailsLMP8601MAX/NOPB Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Supply Current (Isup): | 1.5 mA |
Sub-Category: | Other Analog ICs |
Surface Mount: | YES |
Terminal Finish: | MATTE TIN |
No. of Terminals: | 8 |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE |
JESD-30 Code: | R-PDSO-G8 |
Package Shape: | RECTANGULAR |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 125 Cel |
Package Code: | SOP |
Moisture Sensitivity Level (MSL): | 1 |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | SOP8,.25 |
Other IC type: | ANALOG CIRCUIT |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | AUTOMOTIVE |
Power Supplies (V): | 3.3/5 |