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LMH2110TMX/NOPB
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ManufacturerNational Semiconductor
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Manufacturer's Part NumberLMH2110TMX/NOPB
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DescriptionANALOG CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: FBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
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Datasheet
2819 In Stock
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DetailsLMH2110TMX/NOPB Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Supply Current (Isup): | 5.9 mA |
| Sub-Category: | Other Analog ICs |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 6 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA6,2X3,16 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Other IC type: | ANALOG CIRCUIT |
| JESD-30 Code: | R-PBGA-B6 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | FBGA |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 2.7/5 |
| Moisture Sensitivity Level (MSL): | 1 |
