LMH2110TMX/NOPB by National Semiconductor

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LMH2110TMX/NOPB

Manufacturer

National Semiconductor
Manufacturer's Part Number

LMH2110TMX/NOPB
Description

ANALOG CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: FBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
Datasheet

Datasheet

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LMH2110TMX/NOPB Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s):	40
Maximum Supply Current (Isup):	5.9 mA
Sub-Category:	Other Analog ICs
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
No. of Terminals:	6
Qualification:	Not Qualified
Package Equivalence Code:	BGA6,2X3,16
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Other IC type:	ANALOG CIRCUIT
JESD-30 Code:	R-PBGA-B6
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Peak Reflow Temperature (C):	260
Package Code:	FBGA
Terminal Pitch:	.4 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	2.7/5
Moisture Sensitivity Level (MSL):	1

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