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MAX24287ETK2
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ManufacturerMicrosemi
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Manufacturer's Part NumberMAX24287ETK2
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DescriptionSUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: HVQCCN; Package Shape: SQUARE;
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Datasheet
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DetailsMAX24287ETK2 Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Other Names: | MAX24287ETK+ MAX24287ETK+-ND |
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 1.2 V |
| Telecom IC Type: | SUPPORT CIRCUIT |
| Maximum Seated Height: | .8 mm |
| Surface Mount: | YES |
| Terminal Finish: | Matte Tin (Sn) |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 68 |
| Package Equivalence Code: | LCC68,.32SQ,16 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Data Rate: | 1000 Mbps |
| Length: | 8 mm |
| JESD-30 Code: | S-XQCC-N68 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | HVQCCN |
| Width: | 8 mm |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | INDUSTRIAL |