MCP23S09-E/P by Microchip Technology

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MCP23S09-E/P

  • Manufacturer
    Microchip Technology
  • Manufacturer's Part Number
    MCP23S09-E/P
  • Description
    PARALLEL IO PORT, GENERAL PURPOSE; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
  • Datasheet

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MCP23S09-E/P Technical Details

TYPE DESCRIPTION
Minimum Supply Voltage: 1.8 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Maximum Seated Height: 5.334 mm
Sub-Category: Parallel IO Port
Surface Mount: NO
Maximum Supply Current: 1 mA
Terminal Finish: MATTE TIN
No. of Terminals: 18
Terminal Position: DUAL
Package Style (Meter): IN-LINE
No. of I/O Lines: 8
Screening Level: TS 16949
Technology: CMOS
JESD-30 Code: R-PDIP-T18
Maximum Clock Frequency: 10 MHz
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 125 Cel
Package Code: DIP
Width: 7.62 mm
No. of Bits: 8
No. of Ports: 1
Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE
Maximum Supply Voltage: 5.5 V
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: DIP18,.3
Length: 22.86 mm
Terminal Pitch: 2.54 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 2/5

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