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MCP23S09-E/MG

Manufacturer

Microchip Technology
Manufacturer's Part Number

MCP23S09-E/MG
Description

PARALLEL IO PORT, GENERAL PURPOSE; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
Datasheet

Datasheet

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MCP23S09-E/MG Technical Details

TYPE	DESCRIPTION
Minimum Supply Voltage:	1.8 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	5 V
Maximum Time At Peak Reflow Temperature (s):	40
Maximum Seated Height:	.9 mm
Sub-Category:	Parallel IO Port
Surface Mount:	YES
Maximum Supply Current:	1 mA
Terminal Finish:	MATTE TIN
No. of Terminals:	16
Terminal Position:	QUAD
Package Style (Meter):	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
No. of I/O Lines:	8
Screening Level:	TS 16949
Technology:	CMOS
JESD-30 Code:	S-PQCC-N16
Maximum Clock Frequency:	10 MHz
Package Shape:	SQUARE
Terminal Form:	NO LEAD
Maximum Operating Temperature:	125 Cel
Package Code:	HVQCCN
Width:	3 mm
Moisture Sensitivity Level (MSL):	1
No. of Bits:	8
Other Names:	MCP23S09EMG
No. of Ports:	1
Peripheral IC Type:	PARALLEL IO PORT, GENERAL PURPOSE
Maximum Supply Voltage:	5.5 V
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
Qualification:	Not Qualified
Package Equivalence Code:	LCC16,.12SQ,20
Length:	3 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	.5 mm
Temperature Grade:	AUTOMOTIVE
Power Supplies (V):	2/5

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