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MCP23S08-E/ML
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ManufacturerMicrochip Technology
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Manufacturer's Part NumberMCP23S08-E/ML
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DescriptionPARALLEL IO PORT, GENERAL PURPOSE; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
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Datasheet
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DetailsMCP23S08-E/ML Technical Details
TYPE | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 4.5 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 5 V |
Maximum Seated Height: | 1 mm |
Sub-Category: | Parallel IO Port |
Surface Mount: | YES |
Maximum Supply Current: | 1 mA |
Terminal Finish: | MATTE TIN |
No. of Terminals: | 20 |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
No. of I/O Lines: | 8 |
Screening Level: | TS 16949 |
Technology: | CMOS |
JESD-30 Code: | S-PQCC-N20 |
Maximum Clock Frequency: | 10 MHz |
Package Shape: | SQUARE |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 125 Cel |
Package Code: | HVQCCN |
Width: | 4 mm |
Moisture Sensitivity Level (MSL): | 1 |
No. of Bits: | 8 |
No. of Ports: | 1 |
Peripheral IC Type: | PARALLEL IO PORT, GENERAL PURPOSE |
Maximum Supply Voltage: | 5.5 V |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | LCC20,.16SQ,20 |
Length: | 4 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Temperature Grade: | AUTOMOTIVE |
Power Supplies (V): | 5 |