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25LC256-I/P

Manufacturer

Microchip Technology
Manufacturer's Part Number

25LC256-I/P
Description

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Screening Level: AEC-Q100;
Datasheet

Datasheet

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25LC256-I/P Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Programming Voltage (V):	2.5
Minimum Supply Voltage (Vsup):	2.5 V
Sub-Category:	EEPROMs
Surface Mount:	NO
Screening Level:	AEC-Q100
Technology:	CMOS
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Operating Mode:	SYNCHRONOUS
Package Code:	DIP
No. of Ports:	1
Memory Width:	8
Qualification:	Not Qualified
Package Equivalence Code:	DIP8,.3
Minimum Data Retention Time:	200
Terminal Pitch:	2.54 mm
Reverse Pinout:	NO
Maximum Standby Current:	.000001 Amp
Organization:	32KX8
Output Characteristics:	3-STATE
Maximum Seated Height:	5.334 mm
Maximum Supply Current:	6 mA
Terminal Finish:	MATTE TIN
Maximum Write Cycle Time (tWC):	5 ms
No. of Terminals:	8
Maximum Clock Frequency (fCLK):	10 MHz
No. of Words:	32768 words
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Write Protection:	HARDWARE/SOFTWARE
JESD-30 Code:	R-PDIP-T8
Maximum Operating Temperature:	85 Cel
Endurance:	1000000 Write/Erase Cycles
Width:	7.62 mm
Serial Bus Type:	SPI
Other Names:	25LC256IP
Memory Density:	262144 bit
Memory IC Type:	EEPROM
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Length:	9.271 mm
No. of Words Code:	32K
Nominal Supply Voltage / Vsup (V):	5
Parallel or Serial:	SERIAL
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	5.5 V
Power Supplies (V):	2/5

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