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25LC256-I/MF

Manufacturer

Microchip Technology
Manufacturer's Part Number

25LC256-I/MF
Description

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 1;
Datasheet

Datasheet

Not In Stock

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25LC256-I/MF Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s):	40
Programming Voltage (V):	2.5
Minimum Supply Voltage (Vsup):	2.5 V
Sub-Category:	EEPROMs
Surface Mount:	YES
Screening Level:	AEC-Q100
Technology:	CMOS
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Operating Mode:	SYNCHRONOUS
Package Code:	HVSON
Moisture Sensitivity Level (MSL):	1
No. of Ports:	1
Memory Width:	8
Qualification:	Not Qualified
Package Equivalence Code:	SOLCC8,.25
Minimum Data Retention Time:	200
Peak Reflow Temperature (C):	260
Terminal Pitch:	1.27 mm
Reverse Pinout:	NO
Maximum Standby Current:	.000001 Amp
Organization:	32KX8
Output Characteristics:	3-STATE
Maximum Seated Height:	1 mm
Maximum Supply Current:	6 mA
Terminal Finish:	Matte Tin (Sn) - annealed
Maximum Write Cycle Time (tWC):	5 ms
No. of Terminals:	8
Maximum Clock Frequency (fCLK):	10 MHz
No. of Words:	32768 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Write Protection:	HARDWARE/SOFTWARE
JESD-30 Code:	R-PDSO-N8
Maximum Operating Temperature:	85 Cel
Endurance:	1000000 Write/Erase Cycles
Width:	5 mm
Serial Bus Type:	SPI
Other Names:	25LC256IMF
Memory Density:	262144 bit
Memory IC Type:	EEPROM
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Length:	6 mm
No. of Words Code:	32K
Nominal Supply Voltage / Vsup (V):	5
Parallel or Serial:	SERIAL
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	5.5 V
Power Supplies (V):	2/5

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