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25LC256-H/SN
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ManufacturerMicrochip Technology
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Manufacturer's Part Number25LC256-H/SN
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DescriptionEEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
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Datasheet
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Details25LC256-H/SN Technical Details
TYPE | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Programming Voltage (V): | 5 |
Minimum Supply Voltage (Vsup): | 4.5 V |
Sub-Category: | EEPROMs |
Surface Mount: | YES |
Screening Level: | AEC-Q100 |
Technology: | CMOS |
Package Shape: | RECTANGULAR |
Terminal Form: | GULL WING |
Operating Mode: | SYNCHRONOUS |
Package Code: | SOP |
Moisture Sensitivity Level (MSL): | 1 |
No. of Ports: | 1 |
Memory Width: | 8 |
Qualification: | Not Qualified |
Package Equivalence Code: | SOP8,.23 |
Additional Features: | OPERATES WITH 2.5V MIN @ 3MHZ |
Minimum Data Retention Time: | 200 |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1.27 mm |
Maximum Standby Current: | .000001 Amp |
Organization: | 32KX8 |
Output Characteristics: | 3-STATE |
Maximum Seated Height: | 1.75 mm |
Maximum Supply Current: | 5 mA |
Terminal Finish: | MATTE TIN |
Maximum Write Cycle Time (tWC): | 6 ms |
No. of Terminals: | 8 |
Maximum Clock Frequency (fCLK): | 5 MHz |
No. of Words: | 32768 words |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE |
Write Protection: | HARDWARE/SOFTWARE |
JESD-30 Code: | R-PDSO-G8 |
Maximum Operating Temperature: | 150 Cel |
Endurance: | 1000000 Write/Erase Cycles |
Width: | 3.9 mm |
Serial Bus Type: | SPI |
Memory Density: | 262144 bit |
Memory IC Type: | EEPROM |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Length: | 4.9 mm |
No. of Words Code: | 32K |
Nominal Supply Voltage / Vsup (V): | 5 |
Parallel or Serial: | SERIAL |
Temperature Grade: | AUTOMOTIVE |
Maximum Supply Voltage (Vsup): | 5.5 V |
Power Supplies (V): | 2/5 |