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25LC1024T-E/MF
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ManufacturerMicrochip Technology
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Manufacturer's Part Number25LC1024T-E/MF
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DescriptionEEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
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Datasheet
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Details25LC1024T-E/MF Technical Details
TYPE | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Programming Voltage (V): | 5 |
Minimum Supply Voltage (Vsup): | 2.5 V |
Sub-Category: | Flash Memories |
Surface Mount: | YES |
Screening Level: | AEC-Q100 |
Technology: | CMOS |
Package Shape: | RECTANGULAR |
Terminal Form: | NO LEAD |
Operating Mode: | SYNCHRONOUS |
Package Code: | HVSON |
Moisture Sensitivity Level (MSL): | 1 |
No. of Ports: | 1 |
Memory Width: | 8 |
Qualification: | Not Qualified |
Package Equivalence Code: | SOLCC8,.25 |
Additional Features: | 200 YEARS OF DATA RETENTION; 1000000 ENDURANCE CYCLES/WORD |
Minimum Data Retention Time: | 200 |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1.27 mm |
Maximum Standby Current: | .00002 Amp |
Organization: | 128KX8 |
Maximum Seated Height: | 1 mm |
Maximum Supply Current: | 10 mA |
Terminal Finish: | MATTE TIN |
Maximum Write Cycle Time (tWC): | 6 ms |
No. of Terminals: | 8 |
Maximum Clock Frequency (fCLK): | 10 MHz |
No. of Words: | 131072 words |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
Write Protection: | HARDWARE/SOFTWARE |
JESD-30 Code: | R-PDSO-N8 |
Maximum Operating Temperature: | 125 Cel |
Endurance: | 1000000 Write/Erase Cycles |
Width: | 5 mm |
Serial Bus Type: | SPI |
Memory Density: | 1048576 bit |
Memory IC Type: | EEPROM |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Type: | NOR TYPE |
Length: | 6 mm |
No. of Words Code: | 128K |
Nominal Supply Voltage / Vsup (V): | 5 |
Parallel or Serial: | SERIAL |
Temperature Grade: | AUTOMOTIVE |
Maximum Supply Voltage (Vsup): | 5.5 V |
Power Supplies (V): | 3/5 |