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24LC64-I/SMG
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ManufacturerMicrochip Technology
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Manufacturer's Part Number24LC64-I/SMG
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DescriptionEEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
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Datasheet
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Details24LC64-I/SMG Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .000001 Amp |
| Organization: | 8KX8 |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 2.03 mm |
| Minimum Supply Voltage (Vsup): | 2.5 V |
| Sub-Category: | EEPROMs |
| Surface Mount: | YES |
| Maximum Supply Current: | 3 mA |
| Terminal Finish: | Matte Tin (Sn) |
| Maximum Write Cycle Time (tWC): | 5 ms |
| No. of Terminals: | 8 |
| I2C Control Byte: | 1010DDDR |
| Maximum Clock Frequency (fCLK): | .4 MHz |
| No. of Words: | 8192 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE |
| Write Protection: | HARDWARE |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Endurance: | 1000000 Write/Erase Cycles |
| Package Code: | SOP |
| Width: | 5.23 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Serial Bus Type: | I2C |
| Memory Density: | 65536 bit |
| Memory IC Type: | EEPROM |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | SOP8,.3 |
| Length: | 5.245 mm |
| No. of Words Code: | 8K |
| Nominal Supply Voltage / Vsup (V): | 5 |
| Minimum Data Retention Time: | 200 |
| Peak Reflow Temperature (C): | 260 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 5.5 V |
| Power Supplies (V): | 3/5 |