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THGBMJG6C1LBAU7

Manufacturer

Kioxia Holdings
Manufacturer's Part Number

THGBMJG6C1LBAU7
Description

FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Memory Density: 68719476736 bit;
Datasheet

Not In Stock

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THGBMJG6C1LBAU7 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	8GX8
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
No. of Terminals:	153
No. of Words:	8589934592 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B153
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	105 Cel
Package Code:	BGA
Width:	11 mm
Memory Density:	68719476736 bit
Memory IC Type:	FLASH CARD
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Package Equivalence Code:	BGA153,14X14,20
Length:	13 mm
No. of Words Code:	8G
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V

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