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IS43TR16128C-15HBL

Manufacturer

Integrated Silicon Solution
Manufacturer's Part Number

IS43TR16128C-15HBL
Description

DDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 96; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
Datasheet

Datasheet

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IS43TR16128C-15HBL Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	128MX16
Maximum Time At Peak Reflow Temperature (s):	10
Maximum Seated Height:	1.2 mm
Access Mode:	MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup):	1.425 V
Surface Mount:	YES
Terminal Finish:	Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals:	96
No. of Words:	134217728 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B96
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	TFBGA
Width:	9 mm
Moisture Sensitivity Level (MSL):	3
No. of Ports:	1
Memory Density:	2147483648 bit
Self Refresh:	YES
Memory IC Type:	DDR3 DRAM
JESD-609 Code:	e1
Minimum Operating Temperature:	0 Cel
Memory Width:	16
No. of Functions:	1
Length:	13 mm
No. of Words Code:	128M
Nominal Supply Voltage / Vsup (V):	1.5
Additional Features:	PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH
Peak Reflow Temperature (C):	260
Terminal Pitch:	.8 mm
Temperature Grade:	OTHER
Maximum Supply Voltage (Vsup):	1.575 V

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