CYP15G0101DXB-BBXI by Infineon Technologies

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CYP15G0101DXB-BBXI

Manufacturer

Infineon Technologies
Manufacturer's Part Number

CYP15G0101DXB-BBXI
Description

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;
Datasheet

Datasheet

439 In Stock

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CYP15G0101DXB-BBXI Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.3 V
Maximum Time At Peak Reflow Temperature (s):	20
Maximum Seated Height:	1.4 mm
Sub-Category:	Network Interfaces
Surface Mount:	YES
Maximum Supply Current:	.51 mA
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	100
No. of Transceivers:	1
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, LOW PROFILE
Data Rate:	1500 Mbps
Technology:	BICMOS
JESD-30 Code:	S-PBGA-B100
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	LBGA
Width:	11 mm
Moisture Sensitivity Level (MSL):	3
Telecom IC Type:	INTERFACE CIRCUIT
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	BGA100,10X10,40
Length:	11 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	3.3

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