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S25FL256SAGNFI003
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ManufacturerCypress Semiconductor
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Manufacturer's Part NumberS25FL256SAGNFI003
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DescriptionFLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Boot Block: BOTTOM;
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Datasheet
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DetailsS25FL256SAGNFI003 Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Programming Voltage (V): | 3 |
Minimum Supply Voltage (Vsup): | 2.7 V |
Sub-Category: | Flash Memories |
Surface Mount: | YES |
Technology: | CMOS |
Package Shape: | RECTANGULAR |
Terminal Form: | NO LEAD |
Operating Mode: | SYNCHRONOUS |
Package Code: | HVSON |
Moisture Sensitivity Level (MSL): | 3 |
Memory Width: | 4 |
Qualification: | Not Qualified |
Package Equivalence Code: | SOLCC8,.3 |
Alternate Memory Width: | 2 |
Additional Features: | IT ALSO CONFIGURED AS 256M X 1 |
Minimum Data Retention Time: | 20 |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1.27 mm |
Maximum Standby Current: | .0001 Amp |
Organization: | 64MX4 |
Maximum Seated Height: | .8 mm |
Maximum Supply Current: | 100 mA |
Terminal Finish: | Matte Tin (Sn) |
Maximum Write Cycle Time (tWC): | 500 ms |
No. of Terminals: | 8 |
Maximum Clock Frequency (fCLK): | 133 MHz |
No. of Words: | 67108864 words |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
Write Protection: | HARDWARE/SOFTWARE |
JESD-30 Code: | R-PDSO-N8 |
Maximum Operating Temperature: | 85 Cel |
Endurance: | 100000 Write/Erase Cycles |
Width: | 6 mm |
Boot Block: | BOTTOM |
Serial Bus Type: | SPI |
Memory Density: | 268435456 bit |
Memory IC Type: | FLASH |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Type: | NOR TYPE |
Length: | 8 mm |
No. of Words Code: | 64M |
Nominal Supply Voltage / Vsup (V): | 3 |
Parallel or Serial: | SERIAL |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 3.6 V |
Power Supplies (V): | 3/3.3 |