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S25FL256SAGMFI003
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ManufacturerCypress Semiconductor
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Manufacturer's Part NumberS25FL256SAGMFI003
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DescriptionFLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
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Datasheet
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DetailsS25FL256SAGMFI003 Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .0001 Amp |
| Organization: | 64MX4 |
| Maximum Seated Height: | 2.65 mm |
| Programming Voltage (V): | 3 |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Maximum Supply Current: | 100 mA |
| Terminal Finish: | MATTE TIN |
| Maximum Write Cycle Time (tWC): | 500 ms |
| No. of Terminals: | 16 |
| Maximum Clock Frequency (fCLK): | 133 MHz |
| No. of Words: | 67108864 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE |
| Write Protection: | HARDWARE/SOFTWARE |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G16 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Endurance: | 100000 Write/Erase Cycles |
| Package Code: | SOP |
| Width: | 7.5 mm |
| Boot Block: | BOTTOM |
| Serial Bus Type: | SPI |
| Memory Density: | 268435456 bit |
| Memory IC Type: | FLASH |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 4 |
| No. of Functions: | 1 |
| Type: | NOR TYPE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | SOP16,.4 |
| Alternate Memory Width: | 2 |
| Length: | 10.3 mm |
| No. of Words Code: | 64M |
| Nominal Supply Voltage / Vsup (V): | 3 |
| Additional Features: | IT ALSO CONFIGURED AS 256M X 1 |
| Minimum Data Retention Time: | 20 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Power Supplies (V): | 3/3.3 |