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PEX8619-BA50BIG
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ManufacturerBroadcom
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Manufacturer's Part NumberPEX8619-BA50BIG
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DescriptionBUS CONTROLLER, PCI; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: HBGA; Package Shape: SQUARE;
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Datasheet
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DetailsPEX8619-BA50BIG Technical Details
TYPE | DESCRIPTION |
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Minimum Supply Voltage: | .95 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1 V |
Maximum Seated Height: | 1.9 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 324 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B324 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | HBGA |
Width: | 19 mm |
Moisture Sensitivity Level (MSL): | 3 |
Peripheral IC Type: | BUS CONTROLLER, PCI |
Drive Interface Standard: | IEEE 1149.1; IEEE 1149.6 |
Maximum Supply Voltage: | 1.05 V |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA324,18X18,40 |
Length: | 19 mm |
Peak Reflow Temperature (C): | 260 |
Bus Compatibility: | I2C; PCI; SMBUS; SPI; USB |
Terminal Pitch: | 1 mm |
Temperature Grade: | INDUSTRIAL |