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MAX3001EEUP+

Manufacturer

Analog Devices
Manufacturer's Part Number

MAX3001EEUP+
Description

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet

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MAX3001EEUP+ Technical Details

TYPE	DESCRIPTION
Minimum Supply Voltage:	1.2 V
Package Body Material:	PLASTIC/EPOXY
Minimum Supply Voltage-1:	1.65 V
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.1 mm
Sub-Category:	Other Interface ICs
Surface Mount:	YES
Terminal Finish:	Matte Tin (Sn) - annealed
No. of Terminals:	20
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology:	BICMOS
JESD-30 Code:	R-PDSO-G20
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Package Code:	TSSOP
Interface IC Type:	INTERFACE CIRCUIT
Width:	4.4 mm
Maximum Supply Voltage-1:	5.5 V
Moisture Sensitivity Level (MSL):	1
Maximum Supply Voltage:	5.5 V
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
No. of Functions:	8
Qualification:	Not Qualified
Package Equivalence Code:	TSSOP20,.25
Length:	6.5 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	.65 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	1.8/5

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