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ADRV9002BBCZ
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ManufacturerAnalog Devices
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Manufacturer's Part NumberADRV9002BBCZ
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DescriptionTELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;
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Datasheet
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DetailsADRV9002BBCZ Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Telecom IC Type: | TELECOM CIRCUIT |
Maximum Seated Height: | 1.19 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
No. of Terminals: | 196 |
Package Equivalence Code: | BGA196,14X14,32 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
Length: | 12 mm |
JESD-30 Code: | S-PBGA-B196 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 110 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | TFBGA |
Width: | 12 mm |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Moisture Sensitivity Level (MSL): | 3 |