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AS4C64M16D2A-25BIN

Manufacturer

Alliance Memory
Manufacturer's Part Number

AS4C64M16D2A-25BIN
Description

DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Finish: TIN SILVER COPPER;
Datasheet

Datasheet

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AS4C64M16D2A-25BIN Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	64MX16
Maximum Time At Peak Reflow Temperature (s):	20
Maximum Seated Height:	1.2 mm
Access Mode:	MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup):	1.7 V
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	84
No. of Words:	67108864 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B84
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	TFBGA
Width:	8 mm
Moisture Sensitivity Level (MSL):	3
Other Names:	1450-1416
No. of Ports:	1
Memory Density:	1073741824 bit
Self Refresh:	YES
Memory IC Type:	DDR2 DRAM
JESD-609 Code:	e1
Minimum Operating Temperature:	0 Cel
Memory Width:	16
No. of Functions:	1
Length:	12.5 mm
No. of Words Code:	64M
Nominal Supply Voltage / Vsup (V):	1.8
Additional Features:	AUTO/SELF REFRESH
Peak Reflow Temperature (C):	265
Terminal Pitch:	.8 mm
Temperature Grade:	OTHER
Maximum Supply Voltage (Vsup):	1.9 V

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