S29GL512P11FFI010 by Advanced Micro Devices

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S29GL512P11FFI010

Manufacturer

Advanced Micro Devices
Manufacturer's Part Number

S29GL512P11FFI010
Description

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; No. of Words Code: 32M;
Datasheet

Datasheet

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S29GL512P11FFI010 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.000005 Amp
Organization:	32MX16
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	80 mA
Command User Interface:	YES
No. of Terminals:	64
No. of Words:	33554432 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	S-PBGA-B64
No. of Sectors/Size:	512
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	BGA
Memory Density:	536870912 bit
Sector Size (Words):	128K
Toggle Bit:	YES
Memory IC Type:	FLASH
Minimum Operating Temperature:	-40 Cel
Memory Width:	16
Page Size (words):	8/16
Type:	NOR TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA64,8X8,40
Alternate Memory Width:	8
Common Flash Interface:	YES
Maximum Access Time:	110 ns
No. of Words Code:	32M
Ready or Busy:	YES
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL
Data Polling:	YES
Power Supplies (V):	3/3.3

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